TNP Model IRM-K64
IR Microscope

-Backside image of an IC viewed under 10X magnification.

[Features] [Specifications] [Optional Equipments]

Under the IRM-K64, the user can view a clear and sharp internal image of an IC. With long wavelengths (900-1200 nm), Si and GaAs substrates will not affect the penetrating vision of the system. The user will be able to see solder bumps, pads, and flux like never before. Misaligned components can easily be identified. Quality Control and FA jobs will be a lot easier with the aid of an IRM-K64 System. Best of all: no damage is done to the device being observed.

Features

• Inspect flip-chip and final/packaged devices from back side, through Si or GaAs substrates.
• Inspect final packaged devices after stressed environmental tests. An essential step for Quality Assurance.
• Inspect and locate damages caused by ESD.
• Finding defects in metal and polysilicon wiring.
• Check for wire & die bonding quality and accuracy.
• Inspect diffusion patterns.
• Flexible for both: conventional, visible spectrum and NIR spectrum.
• Easily adapted to Backside Probe Stations (Karsuss or Cascade).

Specifications

Infrared CCD Camera and Control Module Spectral Response: 400nm to 1200nm (visible to NIR). Pixels: 380,000 pixels with 100% pixel light sensing area, ZERO geometry distortion.

Video Monitor: 9", 12" or 14" high resolution B/W.

Infrared Microscope: all NIR class: Optical path switching (eyepieces and camera). Stand and stage with Micron precision grade, 8x8" travel. MTI long working distance objective lenses.

Optional Equipments

M575, Backside Polishing/Preparation System.

PEM-1000 Photon Emission Microscope: This system finds the Photon Emission from defect location and see diffusion zone plus the multi-layer interconnect lines at the same time without damaging the DUT.

Please Contact TNP for features and prices

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